Electronic
Manufacturing Module
Outcomes
1. Be able to explain the
scientific principles, engineering challenges, current engineering practices
and non-technical issues associated with electronics manufacturing
2. Be able to explain all steps in “building
from the ground-up”
Preparation
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Chapters
33 and 34 of the text describe electronic manufacturing from the “ground-up”.
The introductory section from Chapter 33 describing the 3D nature of an integrated
circuit. As you examine Figure 33.1 and the description in Section 33.1 think
about how a piece of Si is continually changed by the different layers. Figure
33.3 and the preceding text is an excellent overall perspective of making an IC
and getting it on a circuit board. Try to connect the content of Figure 34.1
and the descriptive text to Figure 33.1 and the Section 34.1, As you examine
Figure 34.2 please zoom in as much as possible to see the different sizes and
types of components on circuit boards. I
found the historical note 34.1 a great concise summary describing the evolution
of printed circuit boards.
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The
following You Tube Videos should help you better understand electronic
manufacturing from the ground up. As you watch the IC Fabrication Video,
pay attention to the full process and try to relate it to Section 33.1. The packaging video shows how
the IC is placed into a chip package so that it can be placed on a circuit
board. The historical perspective is great. Finally the Circuit Board manufacturing
video is a detailed description of circuit board manufacturing.